PART |
Description |
Maker |
TO263 |
Package Outline Drawing Transistor Outline 封装外形图晶体管外形
|
Electronic Theatre Controls, Inc. ETC List of Unclassifed Manufacturers
|
MDP0040 |
PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE
|
Elantec Semiconductor
|
SC70-5 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
AP2309AGN-HF |
3.4 A, 30 V, 0.075 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp.
|
MSA20 |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 20 -铅收缩小型封装(SSOP封装),EIAJ型二.3mm宽包MSA20
|
Fairchild Semiconductor, Corp. Fairchild Semiconductor Corporation
|
DFN2X2-10 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN4X4-16 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN4X4-32 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN3X3-12 |
Package Outline
|
Global Mixed-mode Techn...
|
TSSOP-28-EP |
Package Outline
|
Global Mixed-mode Techn...
|
TSSOP-14 |
Package Outline
|
Global Mixed-mode Techn...
|